Power measurement via bond wire coupling

A power amplifier comprising:

• a transistor device configured to generate a signal;
• an output circuit that establishes an impedance of the power amplifier without a lumped element-based phase shift in the generated signal, the output circuit comprising:
• an input port at which the generated signal is received;
• an output port at which an impedance-adjusted representation of the generated signal is provided;
• and
• a set of bond wires connecting the input and output ports;
• and
• first and second couplers, each comprising a respective coupling bond wire along the set of bond wires for inductive coupling with the set of bond wires, a respective measurement port connected to a first end of the respective coupling bond wire, and a respective termination connected at a second end of the respective coupling bond wire;
• wherein the first coupler is oriented relative to the output circuit to provide a first output on the respective measurement port indicative of forward power provided by the impedance-adjusted representation of the generated signal via the output port, and
• wherein the second coupler is oriented relative to the output circuit to provide a second output on the respective measurement port indicative of reflected power received via the output port.

A method of measuring forward power and reflected power for a power amplifier, the method comprising:

• generating a signal with a transistor device of the power amplifier;
• adjusting an output impedance of the power amplifier for the generated signal via an output circuit, the output circuit comprising:
• an input port at which the generated signal is received;
• an output port at which an impedance-adjusted representation of the generated signal is provided;
• and
• a set of bond wires connecting the input and output ports;
• developing a forward power measurement at a first measurement port via inductive coupling between a first coupling bond wire inductively coupled with the set of bond wires;
• and
• developing a reflected power measurement at a second measurement port via inductive coupling between a second coupling bond wire inductively coupled with the set of bond wires.

A solid-state system comprising:

• a heating cavity configured to contain a load to be heated;
• a transistor device configured to generate a signal to support introduction of energy into the heating cavity;
• an output circuit comprising an input port at which the generated signal is received, an output port at which a representation of the generated signal is provided, and a set of bond wires connecting the input and output ports;
• a power detection circuit comprising first and second couplers, each comprising a respective coupling bond wire along the set of bond wires for inductive coupling with the set of bond wires, the first coupler being oriented relative to the output circuit to measure forward power provided by the representation of the signal via the output port, and the second coupler being oriented relative to the output circuit to measure reflected power received via the output port;
• and
• a processing unit coupled to the power detection circuit to receive signals indicative of the measured forward power and the measured reflected power.