Moisture-Curable Hot Melt Adhesive
AssigneeHenkel AG & Co. KGaA
InventorsKenji Matsuda, Ai Takamori, Tsuyoshi Tamogami
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Abstract
The object of the present invention is to provide a moisture-curable hot melt adhesive having high initial adhesive strength, long open time, excellent coating property and reduced stringing property. The present invention relates to a moisture-curable hot melt adhesive comprising (A) a urethane prepolymer having a terminal isocyanate group, (B) a metallocene-based polyolefin having a viscosity of 10,000 mPa·s or less at a temperature of 170° C. and (C) a polyester-polyether copolymer.
Claims10
A moisture-curable hot melt adhesive comprising:
- (A) a urethane prepolymer having a terminal isocyanate group,
- (B) a metallocene-based polyolefin having a viscosity of 10,000 mPa·s or less at a temperature of 170° C. and
- (C) a polyester-polyether copolymer.
A method for producing a moisture-curable hot melt adhesive comprising:
- reacting a polyol and an isocyanate compound to form (A) a urethane prepolymer having a terminal isocyanate group;
- providing (B) a metallocene-based polyolefin, (C) a polyester-polyether copolymer, (D) an ethylene/carboxylic acid ester copolymer, and (E) an α-methyl styrene-based resin;
- and
- mixing the (A) a urethane prepolymer, (B) the metallocene-based polyolefin, (C) the polyester-polyether copolymer, (D) the ethylene/carboxylic acid ester copolymer, and (E) the α-methyl styrene-based resin to form the moisture-curable hot melt adhesive.
Dependencies are inferred from the claim text.