Cooling electronic devices in a data center with cooling units mounted in bays of a server rack frame assembly

A method of cooling a data center comprising:

• circulating, with at least one cooling unit, a cooling airflow from a human-occupiable workspace of a data center through an open front side of at least one server rack configured to support a plurality of data center computing devices, the at least one server rack positioned in one of the bays of a plurality of bays of a server rack frame assembly that are defined along a lengthwise dimension of the frame assembly, each bay comprising a volume defined at least in part by a specified height that is orthogonal to the lengthwise dimension and a specified width that is parallel to the lengthwise dimension and sized to at least partially enclose the at least one server rack, the at least one cooling unit sized for one of the bays of the plurality of bays of the server rack frame assembly, wherein the specified width and the specified height of the bay are based on a form factor of the at least one server rack, and the at least one perimeter dimension of the cooling unit is based on the form factor of the at least one server rack;
• circulating, with the at least one cooling unit, a heated airflow that comprises heat from the plurality of data center computing devices through an open back side of the at least one server rack into a warm air aisle arranged adjacent the frame assembly;
• circulating, with the at least one cooling unit, the heated airflow from the warm air aisle and through the at least one cooling unit to cool the heated airflow;
• and
• circulating the cooling airflow from the at least one cooling unit into the human occupiable workspace.

A data center cooling system, comprising:

• at least two rows of server racks positioned within a data center building, each row comprising:
• a server rack frame assembly that comprises a plurality of bays defined along a lengthwise dimension of the frame assembly, each bay comprising a volume defined at least in part by two specified dimensions, where the plurality of bays comprise a first portion of bays within the frame assembly along the lengthwise dimension at a first level and a second portion of bays within the frame assembly along the lengthwise dimension at a second level above the first level;
• a plurality of server racks configured to support a plurality of data center computing devices, at least one server rack positioned in a bay in the first portion of bays and at least another server rack positioned in a bay in the second portion of bays;
• and
• a plurality of cooling units, each sized for a bay of the plurality of bays of the server rack frame assembly, at least one cooling unit positioned in a bay in the first portion of bays and at least another cooling unit positioned in a bay in the second portion of bays, wherein at least one perimeter dimension of the cooling unit is based on a form factor of a particular server rack of the plurality of server racks;
• and
• a control system communicably coupled to the plurality of cooling units, the control system configured to control the plurality of cooling units to perform operations comprising:
• circulating a heated airflow from open back sides of the plurality of server racks through the plurality of cooling units;
• cooling, in the plurality of cooling units, the heated air;
• and
• circulating a cooling airflow through open front sides of the at plurality of server racks.

A method of cooling a data center comprising:

• circulating, with at least one cooling unit, a cooling airflow from a human-occupiable workspace of a data center through an open front side of at least one server rack configured to support a plurality of data center computing devices, the at least one server rack positioned in one of the bays of a plurality of bays of a server rack frame assembly that are defined along a lengthwise dimension of the frame assembly, each bay comprising a volume defined at least in part by a specified height that is orthogonal to the lengthwise dimension and a specified width that is parallel to the lengthwise dimension and sized to at least partially enclose the at least one server rack, the at least one cooling unit sized for one of the bays of the plurality of bays of the server rack frame assembly, and the plurality of bays are arranged in a first row of bays and a second row of bays that is positioned vertically above the first row of bays;
• circulating, with the at least one cooling unit, a heated airflow that comprises heat from the plurality of data center computing devices through an open back side of the at least one server rack into a warm air aisle arranged adjacent the frame assembly;
• circulating the heated airflow from the at least one server rack that is mounted in one of the bays in the first row of bays to the at least one cooling unit that is mounted in one of the bays in the second row of bays;
• circulating, with the at least one cooling unit, the heated airflow from the warm air aisle and through the at least one cooling unit to cool the heated airflow;
• circulating the cooling airflow from the at least one cooling unit into the human occupiable workspace;
• and
• circulating the cooling airflow, with the at least one cooling unit that is mounted in the one of the bays in the second row of bays, from the human-occupiable workspace through the at least one server rack that is mounted in the one of the bays in the first row of bays.

A method of cooling a data center comprising:

• circulating, with at least one cooling unit, a cooling airflow from a human-occupiable workspace of a data center through an open front side of a plurality of server racks configured to support a plurality of data center computing devices, at least one server rack of the plurality of server racks positioned in one of the bays of a plurality of bays of a server rack frame assembly that are defined along a lengthwise dimension of the frame assembly, each bay comprising a volume defined at least in part by a specified height that is orthogonal to the lengthwise dimension and a specified width that is parallel to the lengthwise dimension and sized to at least partially enclose the at least one server rack, the at least one cooling unit sized for one of the bays of the plurality of bays of the server rack frame assembly;
• circulating, with the at least one cooling unit, a heated airflow that comprises heat from the plurality of data center computing devices through an open back side of the at least one server rack into a warm air aisle arranged adjacent the frame assembly;
• circulating, with the at least one cooling unit, the heated airflow from the warm air aisle and through the at least one cooling unit to cool the heated airflow;
• circulating the cooling airflow from the at least one cooling unit into the human occupiable workspace;
• adjusting a power density of the plurality of server racks;
• and
• based on the adjusted power density, adjusting a cooling capacity of the at least one cooling unit.