Electronics assemblies incorporating three-dimensional heat flow structures

An electronics assembly comprising:

• a housing defining an enclosure and comprising a component surface, the component surface comprising an opening;
• a substrate comprising a surface defining a plane, wherein the surface of the substrate faces the component surface of the housing;
• a heat generating component coupled to the surface of the substrate;
• a cooling device positioned outside of the plane defined by the surface of the substrate and disposed within the enclosure;
• and
• a three-dimensional heat flow structure comprising:
• a first portion thermally coupled to the heat generating component, the first portion comprising:
• a convergence region;
• a first arm extending from the convergence region;
• and
• a second arm extending from the convergence region, wherein the convergence region, the first arm, and the second arm are planar and parallel to the plane defined by the surface of the substrate;
• a second portion extending from the first portion, wherein:
• the second portion is transverse to the first portion;
• the second portion extends through the opening of the component surface of the housing;
• and
• the second portion is thermally coupled to the cooling device such that the three-dimensional heat flow structure thermally couples the heat generating component to the cooling device.

An electronics assembly comprising:

• a plurality of substrates, wherein each substrate has a surface defining a plane;
• a plurality of heat generating components, each heat generating component coupled to the surface of each of the plurality of substrates;
• a cooling device positioned transverse to the plane defined by the surface of the each of the plurality of substrates;
• and
• a plurality of three-dimensional heat flow structures, each three-dimensional heat flow structure thermally coupled to each of the plurality of heat generating components and comprising:
• a first portion thermally coupled to the heat generating component, wherein at least a portion of the first portion is parallel to the plane defined by the surface of the substrate;
• and
• a second portion extending from the first portion, wherein the second portion is transverse to the plane defined by the surface of the substrate and thermally coupled to the cooling device such that the three-dimensional heat flow structure thermally couples the heat generating component to the cooling device.