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US 2018/0295719 A1Published application
Pad patterns
AssigneeHewlett-Packard Development Company, L.P.
InventorsCharles Nathan Logan, Adrian Rothenbuhler, Christine m. Wells
Life of this patent
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Abstract
In one implementation, a printed circuit board (PCB) includes a plurality of pads that form a pad pattern on the PCB. In that implementation, the plurality of pads include a group of load pads, a dummy pad, and a false pad. The group of load pads act as contact points to establish an electrical path between a first circuitry and a second circuitry. The dummy pad is coupled to a via that floats electrically and the false pad is coupled to a third circuitry.
Claims15
A printed circuit board (PCB) comprising:
- a plurality of pads that form a pad pattern on the PCP, the plurality of pads comprising:
- a group of load pads that act as contact points to establish an electrical path between a first circuitry and a second circuitry;
- a dummy pad coupled to a first via that floats electrically;
- and
- a false pad coupled to a second via that couples to a third circuitry.
2 more elements
A circuit system comprising:
- a pad pattern comprising a first number of pads greater than a second number of pads connectable by a component associated with a group of pads within the pad pattern to establish an electrical path between a first pad of the group of pads and a second pad of the group of pads, the group of pads comprising a power connection pad connected to a power net and a ground connection pad connected to a ground net;
- a plurality of traces coupled to the group of pads by a plurality of vias, the plurality of traces activateable upon a component connection in accordance with load sequence;
- an integrated circuit coupled to the pad pattern by a first trade of the plurality of traces, the first trace located at a first layer of the circuit system;
- and
- a connector coupled to the pad pattern by a second trace of the plurality of traces, the second trace located at a second layer of the circuit system, the is integrated circuit operable to communicate through the connector in response to activation of the group of pads,
- wherein the load sequence comprises an orientation of components to enable connection between the integrated circuit and the connector.
3 more elements
A manufacturing process comprising:
- forming a first trace in a first layer of printed circuit board (PCB) to connect to a first circuitry, the first layer comprising internal layer;
- forming a second trace in the first layer to connect to a second circuitry;
- forming a plurality of pads in a pad pattern on a second layer of the PCB to receive a component in a plurality of orientations to establish an electrical path among the plurality of pads, wherein the plurality of orientations comprises a load sequence orientation that establishes a correct electrical path between the first trace and the second trace;
- forming a first via between the first layer of the PCB and the second layer of the PCB to connect the first trace and a first pad of the plurality of pads;
- and
- forming a second via between the first layer of the PCB and the second layer of the PCB to connect the second trace and a second pad of the plurality of pads.
3 more elements
Dependencies are inferred from the claim text.