Cavities Containing Multi-wiring Structures And Devices

A method for making an interconnection component comprising:

• forming a mask layer covering a first opening in a sheet-like element, the sheet-like element having first and second opposed surfaces, the first opening extending between the first and second surfaces, the element consisting essentially of a material having a coefficient of thermal expansion of less than 10 parts per million per degree Celsius, the first opening including a central opening and a plurality of peripheral openings open to the central opening and extending in an axial direction of the central opening, a conductive seed layer covering an interior surface of the first opening and being disposed between the mask layer and the first and second opposed surfaces of the sheet-like element;
• forming a first mask opening in at least a portion of the mask layer overlying the first opening to expose portions of the conductive seed layer within the peripheral openings;
• and
• forming electrical conductors on exposed portions of the conductive seed layer, the electrical conductors extending within the peripheral openings and onto the first surface.