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US 2018/0295716 A1Published application
Board apparatus
AssigneeLsis Co., Ltd.
InventorsDeok-Young Lim, Chun-Suk Yang
Life of this patent
Estimating the term…
Abstract
Disclosed herein is a board apparatus including a printed circuit board, including a first ground wiring disposed on one surface of the printed circuit board; a second ground wiring disposed on the other surface of the printed circuit board; and a switch module disposed in an overlapped region between the first ground wiring and the second ground wiring, and including a bolt which penetrates through the printed circuit board and a nut which is in contact with the second ground wiring and is coupled to a screw of the bolt.
Claims8
A board apparatus including a printed circuit board, the board apparatus comprising:
- a first ground wiring disposed on one surface of the printed circuit board;
- a second ground wiring disposed on the other surface of the printed circuit board;
- and
- a switch module selectively interrupting a connection between the first ground wiring and the second ground wiring,
- wherein the switch module is disposed in an overlapped region between the first ground wiring and the second ground wiring, and includes a bolt which penetrates through the printed circuit board, and a nut which is in contact with the second ground wiring and is coupled to a screw of the bolt.
2 more elements
Dependencies are inferred from the claim text.