Back to results
US 2018/0295453 A1Published application
Mems microphone modules and wafer-level techniques for fabricating the same
AssigneeHeptagon Micro Optics Pte. Ltd.
InventorsJens Geiger, Markus Rossi, Hartmut Rudmann
Life of this patent
Estimating the term…
Abstract
The disclosure describes various MEMS microphone modules that have a small footprint and can be integrated, for example, into consumer electronic or other devices in which space is at premium. Wafer-level fabrication techniques for making the modules also are described.
Claims13
1-14. (canceled)
A module comprising:
- a MEMS microphone module including:
- a first substrate;
- a second substrate on which is mounted a MEMS microphone device, wherein the second substrate is separated from the first substrate by a first spacer;
- an integrated circuit device mounted on the first substrate and arranged to perform
- processing of signals from the MEMS microphone device;
- and
- a cover separated from the second substrate by a second spacer;
- an opening in the cover or in the second spacer through which sound can enter;
- and
- a second module joined to the MEMS microphone module, wherein the second module and the MEMS microphone module are side-by-side, and wherein interior regions of the second module and the MEMS microphone module are separated from one another by the first and second spacers.
7 more elements
A MEMS microphone module comprising:
- a substrate;
- a MEMS microphone device mounted on a first surface of the substrate;
- an integrated circuit device mounted on a second surface of the substrate, wherein the second surface is on an opposite side of the substrate from the first surface, the integrated circuit device being arranged to perform processing of signals from the MEMS microphone device;
- and
- a cover separated from the substrate by a first spacer;
- a second spacer on the second surface of the substrate;
- and
- an opening in the cover or in the first spacer through which sound can enter.
5 more elements
A wafer-level method of fabricating a plurality of MEMS microphone modules, the method comprising:
- providing a first sub-stack that includes first spacer elements on a first side of a first substrate, the first side of the first substrate also including light emitting devices and integrated circuits mounted thereon, wherein each light emitting device and integrated circuit is surrounded laterally by respective ones of the spacer elements;
- attaching a second substrate to the first spacer elements, wherein MEMS microphone devices are mounted on a surface of the second substrate, the second substrate not extending over the light emitting devices;
- providing a second sub-stack that includes second spacer elements on a first side of a cover wafer;
- and
- attaching the second spacer elements of the second sub-stack to the surface of the second substrate on which the MEMS microphone devices are mounted.
2 more elements
Dependencies are inferred from the claim text.