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US 2018/0294790 A1Published application
Method for fabricating resonator structure and resonator structure
AssigneeInfineon Technologies AG
InventorsHans-Joerg Timme, Carsten Ahrens, Ruediger Bauder
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Abstract
Methods for manufacturing resonator structures and corresponding resonator structures are described. A first wafer including a first piezoelectric material is singulated and bonded to a second wafer.
Claims19
A method for manufacturing a coupled resonator structure, comprising:
- processing a first wafer to form a processed first wafer comprising a first piezoelectric material;
- processing a second wafer to form a processed second wafer comprising a second piezoelectric material;
- singulating the first wafer to form at least one singulated wafer chip;
- bonding the at least one singulated wafer chip to the second wafer to form a joint wafer;
- and
- processing the joint wafer to form a resonator structure comprising a first resonator including the first piezoelectric material and a second resonator including the second piezoelectric material such that the first and second resonators are acoustically coupled with each other.
3 more elements
A method for manufacturing a resonator structure, comprising:
- processing a first wafer to form a processed first wafer comprising a first piezoelectric material;
- processing a second wafer to form a processed second wafer comprising an acoustic termination at a first side thereof;
- singulating the first wafer to form at least one singulated wafer chip;
- bonding the at least one singulated wafer chip to the second wafer such that the first side of the second wafer faces the singulated wafer chip to form a joint wafer;
- and
- processing the joint wafer to form a resonator structure comprising a first resonator including the first piezoelectric material.
3 more elements
A resonator structure, comprising:
- a diced first wafer piece comprising a first piezoelectric material;
- and
- a substrate comprising an acoustic termination at a first side thereof,
- wherein the diced first wafer piece is bonded to a second wafer piece such that the first side of the substrate faces the diced first wafer piece.
1 more element
Dependencies are inferred from the claim text.