Light emitting device manufacturing method and apparatus thereof
AssigneeInt Tech Co., Ltd.
InventorsCheng-Hsin Chen, Huei-Siou Chen, Li-Chen Wei
Life of this patent
Estimating the term…
Abstract
A method of manufacturing a light emitting device includes providing a substrate and forming a plurality of photosensitive bumps over the substrate. The method also includes forming a photosensitive layer over the plurality of photosensitive bumps and patterning the photosensitive layer to form a recess through the photosensitive layer to expose a surface. The method also includes disposing an organic emissive layer on the surface, and removing the patterned photosensitive layer.
Claims20
A method of manufacturing a light emitting device, comprising:
- providing a substrate;
- forming a plurality of photosensitive bumps over the substrate;
- forming a photosensitive layer over the plurality of photosensitive bumps;
- patterning the photosensitive layer to form a recess through the photosensitive layer to expose a surface;
- disposing an organic emissive layer on the surface, and removing the patterned photosensitive layer.
A light emitting device, comprising:
- a substrate;
- a plurality of bumps over the substrate;
- a plurality of light emitting units between the plurality of bumps and over the substrate, wherein each light emitting unit includes a first electrode and an organic emissive layer over the first electrode;
- and
- a common first type carrier injection layer between the first electrode and the organic emissive layer, the common first type carrier injection layer being shared by the plurality of light emitting units.
A light emitting device, comprising:
- a substrate;
- a plurality of bumps over the substrate;
- a plurality of light emitting units between the plurality of bumps and over the substrate, wherein each light emitting unit includes an organic emissive layer and an electrode over the organic emissive layer;
- and
- a carrier transportation layer between the electrode and the organic emissive layer, the carrier transportation layer includes at a first sub carrier-transporation layer and a second sub carrier-transporation layer.
Dependencies are inferred from the claim text.