Composite conducive to heat dissipation of led-mounted substrate and method of manufacturing the same

A method of manufacturing a composite conducive to heat dissipation of an LED-mounted substrate, comprising:

• a stacking step for stacking a ceramic layer, a metal layer, and a graphite layer so that the metal layer is disposed between the ceramic layer and the graphite layer to form a stack structure;
• a clamping step for fixing the stack structure in place with a clamp;
• and
• a heat treatment step for performing a heat treatment process on the stack structure to form the composite conducive to heat dissipation of the LED-mounted substrate,
• wherein the ceramic layer is of a thermal conductivity of 20˜24 W/mK, the metal layer of a thermal conductivity of 100˜200 W/mK, and the graphite layer of an in-plane thermal conductivity of 950 W/mK and a through-plane thermal conductivity of 3 W/mK.