A light emitting device comprising:
- a light emitting element comprising:
- a substrate,
- a first light emitting cell and a second light emitting cell, each comprising a semiconductor layered structure that comprises an n-side semiconductor layer and a p-side semiconductor layer in order from a substrate side,
- a first insulating layer covering an upper side of each of the first light emitting cell and the second light emitting cell and defining first n-side openings and a first p-side opening above each of the first and second light emitting cells,
- a plurality of wiring electrodes covering an upper side of the first insulating layer and comprising:
- a first wiring electrode electrically connected to the p-side semiconductor layer of the first light emitting cell via the first p-side opening above the first light emitting cell,
- a second wiring electrode electrically connected to the n-side semiconductor layer of the first light emitting cell via the first n-side openings above the first light emitting cell and electrically connected to the p-side semiconductor layer of the second light emitting cell via the first p-side opening above the second light emitting cell, and
- a third wiring electrode electrically connected to the n-side semiconductor layer of the second light emitting cell via the first n-side openings above the second light emitting cell,
- a second insulating layer covering an upper side of the plurality of wiring electrodes and defining second n-side openings and a second p-side opening above each of the first and second light emitting cells,
- a first bonding member disposed at the second p-side opening of the first light emitting cell,
- a second bonding member disposed at the second n-side opening of the first light emitting cell,
- a third bonding member disposed at the second p-side opening of the second light emitting cell, and
- a fourth bonding member disposed at the second n-side opening of the second light emitting cell;
- and
- a mounting substrate on which the light emitting element is mounted such that the mounting substrate faces an upper side of the light emitting element, the mounting substrate comprising:
- a first wiring terminal electrically connected to the p-side semiconductor layer of the first light emitting cell via the first bonding member at the second p-side opening corresponding to the first light emitting cell,
- a second wiring terminal electrically connected to the n-side semiconductor layer of the first light emitting cell via the second bonding member at the second n-side opening corresponding to the first light emitting cell and electrically connected to the p-side semiconductor layer of the second light emitting cell via the third bonding member at the second p-side opening corresponding to the second light emitting cell, and
- a third wiring terminal electrically connected to the n-side semiconductor layer of the second light emitting cell via the fourth bonding member at the second n-side opening corresponding to the second light emitting cell.