Method of transferring micro devices

A method of transferring micro devices, comprising:

• providing a carrier substrate, on which a buffer layer and a plurality of micro devices are disposed, the buffer layer being located between the carrier substrate and the micro devices, the buffer layer comprises a plurality of buffer parts corresponding to the micro devices, the buffer parts are separated from one another and expose a portion of the carrier substrate, the micro devices being separated from one another and positioned on the carrier substrate through the buffer layer;
• making a receiving substrate contact the micro devices on the carrier substrate;
• and
• changing a temperature of at least one of the carrier substrate and the receiving substrate such that the carrier substrate and the receiving substrate have different temperatures from each other, so that at least a portion of the micro devices are released from the carrier substrate and transferred onto the receiving substrate.