Light emitting diode device
AssigneeEverlight Electronics Co., Ltd.
InventorsWei-Ting Wu, Jun Yu Chen, Han-Hsiang Chiang, Hsien-Chia Lin, Tzu-Pin Lin
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Abstract
A light emitting diode device is provided. The light emitting diode device has a substrate, a plurality of metal pads, a plurality of LEDs and a first metal conductive wire. A plurality of first metal pads of the metal pads are disposed on a first surface of the substrate, and the LEDs are disposed on a part of the first metal pads. Each of the LEDs has at least one first electrode contact. The first electrode contact of each of the LEDs electrically connected to the first metal conductive wire has the same electrode contact polarity. Moreover, another light emitting diode device is also provided.
Claims20
A light emitting diode (LED) device, comprising:
- a substrate, having a first surface, a second surface disposed opposite to the first surface and a plurality of vias disposed between the first surface and the second surface;
- a plurality of metal pads, including a plurality of first metal pads disposed on the first surface and a plurality of second metal pads disposed on the second surface, the first metal pads disposed on the first surface being electrically connected with the second metal pads disposed on the second surface via the vias;
- a plurality of LED chips, each of which has at least one first electrode contact and at least one second electrode contact, the LED chips being disposed on a part of the first metal pads;
- a wavelength converter covering at least one LED chip, wherein the combination of the light converted by the wavelength converter and the light emitted by the LED chip is white light;
- and
- a metal conductive wire, being adapted to be electrically connected to the at least one first electrode contact of each of the LED chips, wherein an end of the metal conductive wire is electrically connected to one of the first metal pads which is disposed on the first surface of the substrate without the LED chips disposed thereon.
A light emitting diode (LED) device, comprising:
- a substrate, having a first surface, a second surface disposed opposite to the first surface and a plurality of vias disposed between the first surface and the second surface;
- a plurality of metal pads, including a plurality of first metal pads disposed on the first surface and a plurality of second metal pads disposed on the second surface, the first metal pads disposed on the first surface being electrically connected with the second metal pads disposed on the second surface via the vias;
- a plurality of LED chips, each of which has at least one first electrode contact and at least one second electrode contact, the LED chips being disposed on a part of the first metal pads;
- a wavelength converter covering at least one LED chip, wherein the combination of the light converted by the wavelength converter and the light emitted by the LED chip is white light;
- and
- a metal conductive wire, including:
- a first portion being adapted to be electrically connected to the first electrode contacts of each of the LED chips,
- a second portion comprising a first end and a second end, wherein the first end is electrically connected the first portion, and the second end is electrically connected to one of the first metal pads which is disposed on the first surface of the substrate without the LED chips disposed thereon or contacted therewith.
Dependencies are inferred from the claim text.