High-electron-mobility transistor and manufacturing method thereof
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsMING-WEI TSAI, KING-YUEN WONG, CHIH-WEN HSIUNG, MING-CHENG LIN
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsMING-WEI TSAI, KING-YUEN WONG, CHIH-WEN HSIUNG, MING-CHENG LIN
Estimating the term…
Some embodiments of the present disclosure provide a semiconductor device. The semiconductor device includes a semiconductive substrate. A donor-supply layer is over the semiconductive substrate. The donor-supply layer includes a top surface. A gate structure, a drain, and a source are over the donor-supply layer. A passivation layer covers conformally over the gate structure and the donor-supply layer. A gate electrode is over the gate structure. A field plate is disposed on the passivation layer between the gate electrode and the drain. The field plate includes a bottom edge. The gate electrode having a first edge in proximity to the field plate, the field plate comprising a second edge facing the first edge, a horizontal distance between the first edge and the second edge is in a range of from about 0.05 to about 0.5 micrometers.
A semiconductor device, comprising:
A method of manufacturing a semiconductor device, comprising:
A method of manufacturing a semiconductor device, comprising:
Dependencies are inferred from the claim text.