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US 2018/0294346 A1Published application
Integrated circuit heat dissipation using nanostructures
AssigneeInternational Business Machines Corporation
InventorsAlan B. BOTULA, Max L. LIFSON, James A. SLINKMAN, Theodore G. VAN KESSEL, Randy L. WOLF
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Abstract
An approach for heat dissipation in integrated circuit devices is provided. A method includes forming an isolation layer on an electrically conductive feature of an integrated circuit device. The method also includes forming an electrically conductive layer on the isolation layer. The method additionally includes forming a plurality of nanowire structures on a surface of the electrically conductive layer.
Claims12
A method, comprising:
- forming a plurality of nanowire structures on a surface of an electrically conductive layer by applying an electric potential to the electrically conductive layer through a wiring path;
- and
- forming a discontinuity in the wiring path after the plurality of nanowire structures are formed.
Dependencies are inferred from the claim text.