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US 2018/0294302 A1Published application
Image sensing chip packaging structure and method
AssigneeChina Wafer Level CSP Co., Ltd.
InventorsZhiqi Wang, Zhijie Shen, Jiawei Chen
Life of this patent
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Abstract
An image sensor chip package and an image sensor chip packaging method are provided. The image sensor chip package includes: an image sensor chip; a control chip configured to control the image sensor chip; a first substrate electrically connected to the image sensor chip; and a second substrate electrically connected to the control chip. The first substrate is stacked above the second substrate and is electrically connected to the second substrate.
Claims17
An image sensor chip package, comprising:
- an image sensor chip;
- a control chip configured to control the image sensor chip;
- a first substrate electrically connected to the image sensor chip;
- and
- a second substrate electrically connected to the control chip;
- wherein
- the first substrate is stacked above the second substrate and is electrically connected to the second substrate.
4 more elements
An image sensor chip packaging method, comprising:
- providing an image sensor chip and a control chip configured to control the image sensor chip;
- providing a first substrate, and electrically connecting the image sensor chip to the first substrate;
- providing a second substrate, and electrically connecting the control chip to the second substrate;
- and
- stacking the first substrate above the second substrate, and electrically connecting the first substrate to the second substrate.
2 more elements
Dependencies are inferred from the claim text.