Semiconductor device
AssigneeFuji Electric Co., Ltd.
InventorShigeki SATO
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AssigneeFuji Electric Co., Ltd.
InventorShigeki SATO
Estimating the term…
A semiconductor device is provided, in which a loss of a sensing element is small. A semiconductor device including a semiconductor substrate is provided, the semiconductor device including: an upper-surface electrode that is provided on an upper surface of the semiconductor substrate; a sensing electrode that is provided on the upper surface of the semiconductor substrate and is separated from the upper-surface electrode; a lower-surface electrode that is provided on a lower surface of the semiconductor substrate; a main transistor portion that is provided on the semiconductor substrate and is connected to the upper-surface electrode and the lower-surface electrode; a main diode portion that is provided on the semiconductor substrate and is connected to the upper-surface electrode and the lower-surface electrode; and a sense diode portion that is provided to the semiconductor substrate and is connected to the sensing electrode and the lower-surface electrode.
A semiconductor device comprising a semiconductor substrate, the semiconductor device comprising:
Dependencies are inferred from the claim text.