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AssigneeMitsubishi Electric Corporation
InventorsHiroshi YOSHIDA, Yuji IMOTO, Hidetoshi ISHIBASHI, Daisuke MURATA, Kenta NAKAHARA, Seiji Oka, Junji FUJINO, Nobuhiro ASAJI
Estimating the term…
A semiconductor device includes semiconductor chips fixed to a board, an insulating plate having a through-hole formed therein, a first lower conductor including a lower main body formed on the lower surface of the insulating plate and soldered to any of the semiconductor chips, and a lower protrusion portion that connects with the lower main body, and extends to the outside of the insulating plate, a second lower conductor formed on a lower surface of the insulating plate and soldered to any of the semiconductor chips, an upper conductor including an upper main body formed on the upper surface of the insulating plate, and an upper protrusion portion that connects with the upper main body and extends to the outside of the insulating plate, and a connection portion provided in the through-hole and connects the upper main body and the second lower conductor.
A semiconductor device comprising:
Dependencies are inferred from the claim text.