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US 2018/0294251 A1Published application
Semiconductor device including vertically integrated groups of semiconductor packages
AssigneeSanDisk Information Technology (Shanghai) Co., Ltd.
InventorsYangming Liu, Chin-Tien Chiu, Zhongli Ji, Shaopeng Dong, Zengyu Zhou
Life of this patent
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Abstract
A semiconductor device is disclosed including at least first and second vertically stacked and interconnected groups of semiconductor packages. The first and second groups of semiconductor packages may differ from each other in the number of packages and functionality.
Claims31
A semiconductor device, comprising:
- a first semiconductor package, comprising:
- a first substrate,
- a first group of one or more semiconductor die,
- a redistribution layer having a plurality of solder balls affixed to a surface of the redistribution layer, and
- a first mold compound encapsulating at least a portion of the first semiconductor package, at least a portion of the solder balls extending through a surface of the first mold compound;
- and
- a group of one or more second semiconductor packages, comprising:
- at least one second substrate comprising contact pads on at least one surface of the at least one second substrate,
- a second group of one or more semiconductor die, and
- at least one second mold compound encapsulating at least a portion of the at least one second semiconductor package;
- and
- a pattern of the solder balls extending through the surface of the first mold compound matching a pattern of the contact pads on the at least one surface of the at least one second substrate, the solder balls being affixed to the contact pads to couple the first semiconductor package to the group of one or more second semiconductor packages,
- wherein the first group of one or more semiconductor die in the first semiconductor package has a different number of semiconductor die than the second group of semiconductor die in the group of one or more second semiconductor packages.
10 more elements
(canceled)
A semiconductor device, comprising:
- a first group of one or more first semiconductor packages, comprising:
- at least a first substrate,
- a first group of one or more first semiconductor die,
- a redistribution layer having a plurality of solder balls affixed to a surface of the redistribution layer, and
- a first mold compound encapsulating at least a portion of the first group of one or more first semiconductor packages, the solder balls being exposed through a surface of the first mold compound;
- and
- a second group of one or more second semiconductor packages, comprising:
- at least one second substrate comprising contact pads on at least one surface of the at least one second substrate,
- a second group of one or more second semiconductor die, and
- at least one second mold compound encapsulating at least a portion of the second group of one or more second semiconductor packages;
- and
- a pattern of the solder balls of redistribution layer matching a pattern of the contact pads on the at least second substrate, the solder balls being affixed to the contact pads to couple the first group of one or more first semiconductor packages to the second group of one or more second semiconductor packages;
- wherein a functionality of the first group of one or more first semiconductor packages is different than a functionality of the second group of one or more second semiconductor packages.
10 more elements
(canceled)
A semiconductor device, comprising:
- a first group of one or more first semiconductor packages, comprising:
- at least a first substrate means for transferring signals to and from semiconductor die,
- a first group of one or more first semiconductor die mounted on the at least first substrate means,
- redistribution means for electrically connecting a plurality of contact pads on the redistribution means to a plurality of soldering means affixed to a surface of the redistribution means, and
- first encapsulation means for encapsulating at least a portion of the first group of one or more first semiconductor packages, the soldering means being exposed through a surface of the first encapsulation means;
- and
- a second group of one or more second semiconductor packages, comprising:
- at least one second substrate means for transferring signals to and from semiconductor die, the at least one second substrate means comprising electrical connector means on at least one surface of the at least one second substrate,
- a second group of one or more second semiconductor die, and
- second encapsulation means encapsulating at least a portion of the second group of one or more second semiconductor packages;
- and
- a pattern of the soldering means of the redistribution means matching a pattern of the electrical connector means on the at least second substrate, the soldering means being affixed to the electrical connector means to couple the first group of one or more first semiconductor packages to the second group of one or more second semiconductor packages,
- wherein the number of first semiconductor packages in the first group of one or more first semiconductor packages is different than the number of second semiconductor packages in the second group of one or more first semiconductor packages.
10 more elements
(canceled)
A semiconductor device, comprising:
- a first semiconductor package, comprising:
- a first substrate,
- a first group of one or more semiconductor die,
- a redistribution layer having a plurality of solder balls affixed to a surface of the redistribution layer, and
- a first mold compound encapsulating at least a portion of the first semiconductor package, at least a portion of the solder balls extending through a surface of the first mold compound;
- and
- a group of two or more second semiconductor packages mounted on a surface of the first semiconductor package, each of the two or more second semiconductor packages comprising:
- a second substrate comprising contact pads on a surface of the second substrate,
- a second group of one or more semiconductor die,
- a second mold compound encapsulating each of the two or more second semiconductor packages;
- and
- a pattern of the solder balls extending through the surface of the first mold compound matching a pattern of the contact pads on the surface of the each second substrate, the solder balls being affixed to the contact pads to couple the first semiconductor package to the group of two or more second semiconductor packages.
9 more elements
Dependencies are inferred from the claim text.