Method of batch transferring micro semiconductor structures

A method of batch transferring micro semiconductor structures, comprising:

• attaching an adhesive material to a semiconductor device, wherein the semiconductor device comprises a native substrate and array-type micro semiconductor structures grown on the native substrate, and the array-type micro semiconductor structures define a plurality of micro semiconductor structures arranged in an array;
• removing the native substrate from the semiconductor device and remaining the array-type micro semiconductor structures on the adhesive material;
• and
• providing a roll-to-attach mechanism for alternately processing linear contacts between the array-type micro semiconductor structures and a target substrate, wherein the array-type micro semiconductor structures are optionally picked up in batch from the adhesive material and transferred in batch to the target substrate as the linear contacts are alternately processed.