Semiconductor device package and method for manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsChih-Ming HUNG, Meng-Jen WANG, Tsung-Yueh TSAI, Jen-Kai OU
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Abstract
A surface mount structure includes a substrate, a sensor, an electrical contact and a package body. The substrate has a first surface and a second surface opposite to the first surface. The sensor is disposed adjacent to the second surface of the substrate. The electrical contact is disposed on the first surface of the substrate. The package body covers the first surface and the second surface of the substrate, a portion of the sensor and a first portion of the electrical contact.
Claims21
A surface mount structure, comprising:
- a substrate having a first surface and a second surface opposite to the first surface;
- a sensor disposed adjacent to the second surface of the substrate;
- an electrical contact disposed on the first surface of the substrate;
- and
- a package body covering the first surface and the second surface of the substrate, a portion of the sensor, and a first portion of the electrical contact.
A method of manufacturing a surface mount structure, the method comprising:
- (a) providing a substrate having a first surface and a second surface opposite to the first surface;
- (b) disposing an electrical contact on the first surface of the substrate, the electrical contact comprising a first portion and a second portion;
- (c) placing the electrical contact on a tape covering the first portion of the electrical contact and exposing the second portion of the electrical contact;
- (d) forming a package body covering the first surface and the second surface of the substrate and the second portion of the electrical contact;
- and
- (e) removing the tape to expose the first portion of the electrical contact.
Dependencies are inferred from the claim text.