Dummy Conductive Structures for EMI Shielding

A method of making a semiconductor device, comprising:

• forming a first conductive layer;
• forming a second conductive layer aligned with the first conductive layer;
• depositing an encapsulant over the first conductive layer and second conductive layer;
• cutting through the encapsulant, first conductive layer, and second conductive layer;
• and
• depositing a third conductive layer over side surfaces of the first conductive layer, second conductive layer, and encapsulant.

A method of making a semiconductor die, comprising:

• forming a first conductive layer;
• forming a conductive pillar on the first conductive layer;
• forming a second conductive layer on the conductive pillar;
• cutting through the first conductive layer, conductive pillar and second conductive layer;
• and
• depositing a third conductive layer over side surfaces of the first conductive layer and second conductive layer.

A method of making a semiconductor device, comprising:

• forming a first conductive layer;
• forming a conductive pillar over the first conductive layer
• forming a second conductive layer over the conductive pillar and first conductive layer;
• and
• forming a third conductive layer contacting side surfaces of the first conductive layer, conductive pillar, and second conductive layer.