Systems and methods for interconnecting dies
AssigneeApple Inc.
InventorsSanjay Dabral, Zun Zhai
Life of this patent
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Abstract
Stitched die structures, and methods for interconnecting die are described. In an embodiment, a stitched die structure includes a semiconductor substrate that includes a first die first die area of a first die and a second die area of a second die separate from the first die area. A back-end-of-the-line (BEOL) build-up structure spans over the first die area and the second die area, and includes a first metallic seal directly over a first peripheral area of the first die area, a second metallic seal directly over a second peripheral area of the second die area, and a die-to-die routing extending through the first metallic seal and the second metallic seal to electrically connect the first die to the second die.
Claims24
A stitched die structure including:
- a semiconductor substrate including a first die area of a first die and a second die area of a second die separate from the first die area, wherein the first die area includes a first core logic circuit region and a first die-to-die input/output circuit region, and the second die area includes a second core logic circuit region and a second die-to-die input/output circuit region;
- and
- a back-end-of-the-line (BEOL) build-up structure spanning over the first die area and the second die area, the BEOL build-up structure comprising a die-to-die routing to electrically connect the first die-to die input/output circuit region to the second die-to-die input/output circuit region.
A stitched die structure including:
- a semiconductor substrate including a first die first die area of a first die and a second die area of a second die separate from the first die area;
- a back-end-of-the-line (BEOL) build-up structure spanning over the first die area and the second die area, the BEOL build-up structure comprising:
- a die-to-die routing electrically connecting the first die to the second die.
- a metallic seal around the first die area, the second die area and the die-to die routing.
A module comprising:
- a module substrate;
- a stitched die structure mounted on the module substrate, the stitched die structure including a first die area of a first die and a second die area of a second die, and a back-end-of-the-line (BEOL) build-up structure that spans over the first die area and the second die area and electrically connects the first die to the second die;
- and
- a hermetic seal surrounding the stitched die structure.
Dependencies are inferred from the claim text.