Manufacturing method of package structure having embedded bonding film

A manufacturing method of a package structure having an embedded bonding film, comprising:

• forming a bonding film, comprising:
• forming a plurality of dielectric layers and metal circuit layers sequentially and alternatively in a plurality of bonding areas;
• exposing a plurality of top metal pads of a topmost metal circuit layer among the metal circuit layers in the plurality of bonding areas;
• and
• etching to form a bonding film, wherein the bonding film has a left longitudinal branch and a lower latitudinal branch, wherein a lower end of the left longitudinal branch is connected to a left end of the lower latitudinal branch, the plurality of bonding areas includes at least a first bonding area and a second bonding area on the left longitudinal branch and the lower latitudinal branch, respectively, and the left longitudinal branch and the lower latitudinal branch form an L shape;
• forming a redistribution substrate, wherein the bonding film is embedded at a top side of the redistribution substrate;
• and
• forming a core on a bottom side of the redistribution substrate opposite to the top side, wherein a Young's modulus of the core is greater than a Young's modulus of the redistribution substrate.