Semiconductor package structure
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsJie CHEN, Hsien-Wei CHEN
Life of this patent
Estimating the term…
Abstract
Semiconductor package structures are provided. A semiconductor package structure includes a chip, a molding material surrounding the chip, a through-via extending from a first surface to a second surface of the molding material, and a first re-distribution layer (RDL) wire disposed on the second surface of the molding material and electrically separated from the through-via. The second surface is opposite to the first surface. A portion of the first RDL wire across the through-via has a first segment with a first width and a second segment with a second width different from the first width.
Claims20
A semiconductor package structure, comprising:
- a chip;
- a molding material surrounding the chip;
- a through-via extending from a first surface to a second surface of the molding material, wherein the second surface is opposite to the first surface;
- and
- a first re-distribution layer (RDL) wire disposed on the second surface of the molding material and electrically separated from the through-via,
- wherein a portion of the first RDL wire across the through-via has a first segment with a first width and a second segment with a second width different from the first width.
A semiconductor package structure, comprising:
- a base;
- a through-via in the base;
- and
- a re-distribution layer level on the base, and comprising:
- an RDL wire across the through-via, comprising a pad disposed on intersection at an edge of the through-via in a plan view,
- wherein a diameter of the pad is greater than a width of the RDL wire.
A semiconductor package structure, comprising:
- a chip;
- a molding material surrounding the chip;
- a polymer material disposed on the molding material and chip;
- a through-via on the chip and surrounded by the polymer material;
- and
- a first re-distribution layer wire disposed on the polymer material and electrically separated from the through-via,
- wherein a portion of the first RDL wire across the through-via has a first segment with a first width and a second segment with a second width different from the first width.
Dependencies are inferred from the claim text.