Package structure

A package structure, comprising:

• a lead frame comprising a plurality of first contacts and at least one second contact;
• an insulator covering the lead frame and comprising at least one opening, wherein the opening exposes the second contact;
• a plurality of first conductive vias disposed on the insulator and connected to the first contacts;
• a patterned metal layer covering an outer surface of the insulator and comprising a first groove and a circuit portion, the circuit portion connecting and covering the first conductive vias, the first contacts, the opening, and the second contact, and the first groove surrounding the circuit portion such that the circuit portion is electrically insulated from the rest of the patterned metal layer, wherein a surface of the insulator exposed by the first groove is lower than the outer surface;
• and
• a chip disposed on the insulator and electrically connected to the circuit portion.

A package structure, comprising:

• a substrate comprising a plurality of electrical contacts, an active surface, and a back surface opposite to the active surface, wherein the electrical contacts are disposed on the active surface;
• an insulator disposed on the substrate and at least covering the active surface;
• a plurality of first conductive vias disposed on the insulator and connected to the electrical contacts;
• a patterned metal layer covering an outer surface of the insulator and comprising a first groove and a first circuit portion, the first circuit portion connecting and covering the first conductive vias and the electrical contacts, and the first groove surrounding the circuit portion such that the first circuit portion is electrically insulated from the rest of the patterned metal layer, wherein a surface of the insulator exposed by the first groove is lower than the outer surface.

A package structure, comprising:

• an insulator;
• a plurality of first conductive vias penetrating through the insulator;
• a patterned metal layer covering an outer surface of the insulator and comprising a first groove, a circuit portion, and a plurality of external pads, the circuit portion connecting and covering the first conductive vias, and the first groove surrounding the circuit portion to electrically insulate the circuit portion from the rest of the patterned metal layer, wherein a surface of the insulator exposed by the first groove is lower than the outer surface, the external pads are disposed on a lower surface of the insulator electrically connected to the first conductive vias, and electrically insulated from the rest of the patterned metal layer, and the lower surface is opposite to a surface where the first groove is located;
• and
• a chip disposed on the insulator and electrically connected to the circuit portion.