Semiconductor device and manufacturing method thereof
AssigneeFujitsu Limited
InventorHironori KAWAMINAMI
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes: a first semiconductor chip that includes through electrodes; a second semiconductor chip; and an interposer that has a recessed portion formed in a front surface thereof and includes a first wiring provided under a bottom surface of the recessed portion, in which the first semiconductor chip is fitted in the recessed portion with a chip top surface thereof flipped down to be electrically connected to the first wiring, the second semiconductor chip is connected on the front surface, of the interposer, around the recessed portion, and at the same time, is stacked on the first semiconductor chip in a manner to partially overlap the first semiconductor chip, and is electrically connected to the first semiconductor chip via the through electrodes.
Claims20
A semiconductor device, comprising:
- a connection structure that has a recessed portion formed in a front surface thereof;
- a first semiconductor chip that comprises through electrodes in one end portion of a rear surface thereof, the through electrodes penetrating a semiconductor substrate, and is fitted in the recessed portion with a chip top surface thereof flipped down to be connected to the connection structure;
- and
- a second semiconductor chip that is connected on the one end portion of the first semiconductor chip and on the connection structure and is electrically connected to the first semiconductor chip via the through electrodes.
A manufacturing method of a semiconductor device that comprises:
- a connection structure that has a recessed portion formed in a front surface thereof;
- a first semiconductor chip that comprises through electrodes in one end portion of a rear surface thereof, the through electrodes penetrating a semiconductor substrate;
- and a second semiconductor chip, the manufacturing method comprising:
- fitting the first semiconductor chip in the recessed portion with a chip top surface thereof flipped down and connecting the first semiconductor chip to the connection structure, and connecting the second semiconductor chip on the one end portion of the first semiconductor chip and on the connection structure;
- and
- electrically connecting the first semiconductor chip and the second semiconductor chip via the through electrodes.
Dependencies are inferred from the claim text.