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US 2018/0294210 A1Published application
Package with component connected with carrier via spacer particles
AssigneeInfineon Technologies AG
InventorsManfred Schindler, Franz-Peter Kalz, Volker Strutz
Life of this patent
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Abstract
A package and method of making a package. In one example, the package includes an at least partially electrically conductive carrier, a passive component mounted on the carrier, and an at least partially electrically conductive connection structure electrically connecting the carrier with the component and comprising spacer particles configured for spacing the carrier with regard to the component.
Claims17
A package, comprising:
- an at least partially electrically conductive carrier;
- a passive component mounted on the carrier;
- an at least partially electrically conductive connection structure electrically connecting the carrier with the component and comprising spacer particles configured for spacing the carrier with regard to the component;
- wherein the connection structure comprises an at least partially electrically conductive glue in which the spacer particles are embedded;
- wherein a spacer material of the spacer particles is polymeric;
- and
- wherein the carrier comprises a first carrier section and a second carrier section separated by a recess, wherein the component has a first surface portion electrically connected with the first carrier section by a first portion of the connection structure and has a second surface portion electrically connected with the second carrier section by a separate second portion of the connection structure.
4 more elements
A package, comprising:
- a plate-type carrier which comprises a first carrier section and a second carrier section separated by a recess;
- a passive component having a first surface portion electrically connected with the first carrier section by a first portion of a connection structure and having a second surface portion electrically connected with the second carrier section by a second portion of the connection structure;
- the connection structure configured for spacing the carrier with regard to the component by maintaining a minimum distance (d) of at least 10 μm;
- an encapsulant encapsulating at least part of the component;
- wherein the connection structure comprises an at least partially electrically conductive glue in which the spacer particles are embedded;
- wherein a spacer material of the spacer particles is polymeric;
- and
- wherein the carrier comprises a first carrier section and a second carrier section separated by a recess, wherein the component has a first surface portion electrically connected with the first carrier section by a first portion of the connection structure and has a second surface portion electrically connected with the second carrier section by a separate second portion of the connection structure.
5 more elements
A method of manufacturing a package, comprising:
- mounting a passive electronic component on a completely electrically conductive carrier;
- forming an at least partially electrically conductive connection structure electrically connecting the carrier with the component and comprising spacer particles spacing the carrier with regard to the component;
- wherein the connection structure comprises an at least partially electrically conductive glue in which the spacer particles are embedded;
- wherein a spacer material of the spacer particles is polymeric;
- and
- wherein the carrier comprises a first carrier section and a second carrier section separated by a recess, wherein the component has a first surface portion electrically connected with the first carrier section by a first portion of the connection structure and has a second surface portion electrically connected with the second carrier section by a separate second portion of the connection structure.
3 more elements
Dependencies are inferred from the claim text.