Sensor packaging and method for manufacturing the same
AssigneeIndustry-University Cooperation Foundation Hanyang University
InventorSang Won YOON
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Abstract
A method for manufacturing a sensor packaging according to an exemplary embodiment of the present disclosure includes: forming a via hole penetrating a main substrate by etching each of both surfaces of the main substrate; forming an insulating layer on a wall surface of the via hole and the both surfaces of the main substrate; combining a sub-substrate on which a metallic seed layer and a bonding layer having a pattern for exposing a part of the seed layer are laminated with the main substrate; forming a filling layer configured to cover an upper surface of the main substrate by filling metal in the via hole; and removing the sub-substrate from the main substrate.
Claims12
A method for manufacturing a sensor packaging, the method comprising:
- forming a via hole penetrating a main substrate by etching each of both surfaces of the main substrate;
- forming an insulating layer on a wall surface of the via hole and the both surfaces of the main substrate;
- combining a sub-substrate on which a metallic seed layer and a bonding layer having a pattern for exposing a part of the seed layer are laminated with the main substrate;
- forming a filling layer configured to cover an upper surface of the main substrate by filling metal in the via hole;
- and
- removing the sub-substrate from the main substrate.
A sensor packaging comprising:
- a via hole formed by penetrating both surfaces of a main substrate;
- an insulating layer formed on a wall surface of the via hole and the both surfaces of the main substrate;
- and
- a filling layer formed by being filled in the via hole,
- wherein the wall surface of the via hole is formed as a bent slanted surface.
Dependencies are inferred from the claim text.