Semiconductor device, method for manufacturing semiconductor device, and interface unit

A method for manufacturing a semiconductor device comprising:

• providing a plurality of semiconductor units in parallel on a base plate, the plurality of semiconductor units implementing a pair, each semiconductor unit including a semiconductor chip and a rod-shaped unit-side control terminal, the unit-side control terminal being connected to the semiconductor chip, the unit-side control terminal extending opposite to the base plate;
• mounting an interface unit on the plurality of semiconductor units, the interface unit including a box-shaped accommodating portion, the accommodating portion including an internal wiring and a rod-shaped external-connecting control terminal, the internal wiring being connected to each of the plurality of the unit-side control terminals extending from the plurality of semiconductor units, the external-connecting control terminal extending to the outside opposite to the semiconductor units, the external-connecting control terminal being connected to the internal wiring;
• and
• connecting the unit-side control terminals of the plurality of semiconductor units and the internal wiring.