Radiation plate structure, semiconductor device, and method for manufacturing radiation plate structure
AssigneeMitsubishi Electric Corporation
InventorsYukimasa HAYASHIDA, Hiroki SHIOTA
Life of this patent
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Abstract
A radiation plate structure includes a radiation plate, and a solder resist disposed on a main surface of the radiation plate and having at least one opening. The solder resist is made of any of polyimide (PI), polyamide (PA), polypropylene (PP), polyphenylene sulfide (PPS), a resin containing particulate ceramic (e.g., aluminum nitride (AlN), silicon nitride (Si3N4), or aluminum oxide (Al2O3)), and a high-melting-point insulator made of, for instance, glass.
Claims21
A radiation plate structure comprising:
- a radiation plate;
- and
- a solder resist disposed on a main surface of the radiation plate and comprising at least one opening, wherein
- the solder resist comprises any of polyimide (PI), polyimide (PA), polypropylene (PP), and polyphenylene sulfide (PPS).
A radiation plate structure comprising:
- a radiation plate;
- and
- a solder resist disposed on a main surface of the radiation plate and comprising at least one opening, wherein
- the solder resist comprises a resin comprising particulate ceramic.
A radiation plate structure comprising:
- a radiation plate;
- and
- a solder resist disposed on a main surface of the radiation plate and comprising at least one opening, wherein
- the solder resist comprises a high-melting-point insulator having a melting point of 400 degrees or more.
A semiconductor device comprising:
- a radiation plate;
- a solder resist disposed on a main surface of the radiation plate and comprising at least one opening;
- an insulating substrate soldered to the radiation plate within the opening of the solder resist;
- and
- a semiconductor element disposed on the insulating substrate, wherein
- the solder resist has a thickness greater than a thickness of solder with which the radiation plate is joined to the insulating substrate.
A method for manufacturing a radiation plate structure, comprising:
- preparing a radiation plate;
- preparing a solder resist sheet comprising at least opening;
- and
- attaching the solder resist sheet to a main surface of the radiation plate to form a solder resist onto the main surface.
Dependencies are inferred from the claim text.