Chip package structure and manufacturing method thereof
AssigneesIndustrial Technology Research Institute, Intellectual Property Innovation Corporation
InventorsWei-Yuan Cheng, Cheng-Chung Lee, Shau-Fei Cheng, Wen-Lung Chen
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Abstract
A chip package structure and a manufacturing method thereof are provided. The chip package structure includes a frame disposed around a chip, a filling material filled in the space between the chip and the frame, and a protection layer covering the chip, the frame, and the filling material. The Young's modulus of the filling material is respectively smaller than the Young's modulus of the chip, the Young's modulus of the frame, and the Young's modulus of the protection layer.
Claims20
A chip package structure, comprising:
- a redistribution layer, wherein the redistribution layer has an upper surface;
- a chip disposed on the upper surface of the redistribution layer and electrically connected to the redistribution layer;
- a frame disposed on the upper surface of the redistribution layer and surrounding the chip;
- a filling material disposed on the upper surface of the redistribution layer and located between the frame and the chip;
- and
- a protection layer covering the chip, the frame, and the filling material, wherein a Young's modulus of the filling material is respectively smaller than a Young's modulus of the chip, a Young's modulus of the frame, and a Young's modulus of the protection layer, and a filling thickness of the filling material is at least 1.5 times a thickness of the protection layer.
A chip package structure, comprising:
- a redistribution layer, wherein the redistribution layer has an upper surface;
- a chip disposed on the upper surface of the redistribution layer and electrically connected to the redistribution layer;
- a frame disposed on the upper surface of the redistribution layer and surrounding the chip;
- a filling material disposed on the upper surface of the redistribution layer and located between the frame and the chip, wherein a viscosity of the filling material is 2,000 mPa·s to 20,000 mPa·s at 25° C.;
- and
- a protection layer covering the chip, the frame, and the filling material, wherein a Young's modulus of the filling material is respectively smaller than a Young's modulus of the chip, a Young's modulus of the frame, and a Young's modulus of the protection layer.
A manufacturing method of a chip package structure, comprising:
- forming a redistribution layer;
- bonding a plurality of chips on the redistribution layer;
- forming a plurality of frames on the redistribution layer to respectively surround at least one of the chips;
- filling a filling material in a space between the frames and the chips;
- forming a protection layer on the chips, the frames, and the filling material, wherein a Young's modulus of the filling material is respectively smaller than a Young's modulus of the chips, a Young's modulus of the frames, and a Young's modulus of the protection layer;
- and
- performing a singulation process.
Dependencies are inferred from the claim text.