Method of manufacturing ultra thin wafers
AssigneeIntel Corporation
InventorXavier F. Brun
Life of this patent
Estimating the term…
Abstract
Some example forms relate to a method of manufacturing ultra-thin wafers. The method includes attaching a wafer that includes a plurality of electronic components to a carrier wafer that includes an adhesive; segregating the plurality of dice into individual electronic components, wherein segregating the plurality of dice into individual electronic components includes thinning and dicing the wafer; performing at least one of coating, scribing or marking any of the individual electronic components that form the wafer; and removing the plurality of electronic components from the carrier wafer, wherein removing the plurality of electronic components from the carrier wafer includes at least one of exposing the carrier to ultraviolet radiation or raising the temperature of the wafer.
Claims21
1-20. (canceled)
A method comprising:
- attaching a wafer that includes a plurality of electronic components to a carrier wafer that includes an adhesive;
- segregating the plurality of electronic components into individual electronic components;
- and
- removing the plurality of electronic components from the carrier wafer.
A method comprising:
- attaching a wafer that includes a plurality of electronic components to a carrier wafer that includes an adhesive;
- segregating the plurality of dice into individual electronic components, wherein segregating the plurality of dice into individual electronic components includes thinning and dicing the wafer;
- performing at least one of coating, scribing or marking any of the individual electronic components that form the wafer;
- and
- removing the plurality of electronic components from the carrier wafer, wherein removing the plurality of electronic components from the carrier wafer includes at least one of exposing the carrier to ultraviolet radiation or raising the temperature of the wafer.
A method comprising:
- attaching a wafer that includes a plurality of dice to a carrier wafer that includes an adhesive;
- segregating the plurality of dice into individual dies;
- and
- performing at least one of coating, scribing or marking any of the individual dies that form the wafer;
- cleaning the plurality of dice;
- and
- removing the plurality of dice from the carrier wafer.
Dependencies are inferred from the claim text.