Substrate cleaning apparatus, substrate cleaning method, and control method of substrate cleaning apparatus

A substrate cleaning method comprising:

• holding and rotating a substrate;
• contacting an elongated cleaning member with the substrate;
• and
• supplying liquid from a first nozzle to a first area in the substrate and supplying liquid from a second nozzle to a second area in the substrate while contacting the elongated cleaning member with the substrate, thereby cleaning the substrate, wherein
• the first area and the second area are arranged on an identical side with respect to a longitudinal direction of the cleaning member,
• the second area is larger than the first area, and
• the first nozzle supplies liquid more forcefully than the second nozzle.

A method of controlling a substrate cleaning apparatus, the method comprising:

• holding and rotating a substrate;
• contacting an elongated cleaning member with the substrate;
• and
• supplying liquid from a first nozzle to a first area in the substrate and supplying liquid from a second nozzle to a second area in the substrate while contacting the elongated cleaning member with the substrate, thereby cleaning the substrate, wherein
• the first area and the second area are arranged on an identical side with respect to a longitudinal direction of the cleaning member,
• the second area is larger than the first area, and
• the first nozzle supplies liquid more forcefully than the second nozzle.