Wiring board, tft substrate, method for manufacturing wiring board, and method for manufacturing tft substrate
AssigneeSakai Display Products Corporation
InventorRyo MURATA
Life of this patent
Estimating the term…
Abstract
There is provided a TFT substrate that prevents corrosion of a gate electrode and a method for manufacturing the TFT substrate. The TFT substrate comprises a substrate; a gate comprising a gate electrode and a gate wiring, the gate comprising copper and formed on one surface of the substrate; a protection film to cover the gate; an insulation film formed on the protection film; a semiconductor film formed on the insulation film; and a source and a drain formed on the semiconductor film and facing each other with a space therebetween above the gate electrode, wherein the protection film covers entire exposed surface of the gate.
Claims6
A TFT substrate comprising:
- a substrate;
- a gate comprising a gate electrode and a gate wiring, the gate comprising copper and formed on one surface of the substrate;
- a protection film to cover the gate;
- an insulation film formed on the protection film;
- a semiconductor film formed on the insulation film;
- and
- a source and a drain formed on the semiconductor film and facing each other with a space therebetween above the gate electrode,
- wherein the protection film covers entire exposed surface of the gate.
A method for manufacturing a TFT substrate comprising:
- forming a gate comprising a gate electrode and a gate wiring on one surface of a substrate, the gate comprising copper;
- forming a protection film to cover the gate;
- forming an insulation film on the protection film;
- forming a semiconductor film on the insulation film;
- and
- forming a source and a drain on the semiconductor film in such a way the source and the drain facing each other with a space therebetween above the gate electrode,
- wherein the protection film is formed so as to cover entire exposed surface of the gate.
Dependencies are inferred from the claim text.