Semiconductor device
AssigneeRenesas Electronics Corporation
InventorsKenichiro SONODA, Eiji TSUKUDA, Keiichi MAEKAWA
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AssigneeRenesas Electronics Corporation
InventorsKenichiro SONODA, Eiji TSUKUDA, Keiichi MAEKAWA
Estimating the term…
A semiconductor device is provided that is capable of reducing the possibility of change in state of memory elements formed over a semiconductor substrate with an insulating layer interposed therebetween. The semiconductor device includes nonvolatile memory elements and a bias circuit. Each of the nonvolatile memory elements includes a drain region and a source region arranged so as to sandwich a semiconductor region where a channel is formed, a gate electrode, and a charge storage layer arranged between the gate electrode and the semiconductor region. The nonvolatile memory elements are arranged over the semiconductor substrate with the insulating layer interposed therebetween. When electrons are stored in the charge storage layer, the bias circuit reduces the potential difference between the gate electrode and at least one of the drain region and source region in order to decrease holes stored in the channel of a nonvolatile memory element.
A method of programing a nonvolatile memory cell formed in a main surface of an SOI layer, the nonvolatile memory cell comprising a gate electrode, a source region, a drain region and a charge storage layer between the gate electrode and the SOI layer, the method comprising steps of:
Dependencies are inferred from the claim text.