Component built-in device, rfid tag, and method for manufacturing component built-in device
AssigneeMurata Manufacturing Co., Ltd.
InventorsMakoto OSAMURA, Yoshihito OTSUBO
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Abstract
An RFID module includes a laminated body including thermoplastic resin layers, a passive element defined by a conductor pattern on the thermoplastic resin layers, and an RFID IC chip embedded in the laminated body. The RFID IC chip and the conductor pattern are connected to each other by joining an input and output terminal of the RFID IC chip and a pad electrode, and an insulator pattern overlapping the pad electrode is provided around the RFID IC chip in the laminated body in planar view.
Claims20
A component built-in device comprising:
- a laminated body including a plurality of thermoplastic resin layers;
- a passive element defined by a conductor pattern provided on the thermoplastic resin layers;
- and
- a chip electronic component embedded in the laminated body;
- wherein
- the chip electronic component includes an input and output terminal;
- the laminated body includes a pad electrode connected to the passive element;
- the chip electronic component and the passive element are connected to each other via a direct or indirect connection between the input and output terminal and the pad electrode;
- and
- a belt-shaped, annular-shaped, or partially annular-shaped insulator pattern overlapping the pad electrode is provided around the chip electronic component in the laminated body in a planar view from a laminating direction of the thermoplastic resin layer.
An RFID tag comprising:
- a flexible insulator substrate including a radiating element;
- and
- an RFID module including an external terminal, the RFID module being mounted on the insulator substrate, and the external terminal being connected to the radiating element;
- wherein
- the RFID module includes:
- a laminated body including a plurality of thermoplastic resin layers;
- a coil-shaped conductor pattern defined by a conductor formed on the thermoplastic resin layers;
- and
- an RFID IC embedded in the laminated body;
- the RFID IC includes an input and output terminal;
- the laminated body includes a pad electrode and the external terminal which are connected to the coil-shaped conductor pattern;
- the RFID IC and the coil-shaped conductor pattern are connected to each other via a direct or indirect connection between the input and output terminal and the pad electrode;
- and
- a belt-shaped, annular-shaped, or partially annular-shaped insulator pattern overlapping the pad electrode is provided around the RFID IC in the laminated body in a planar view from a laminating direction of the thermoplastic resin layers.
A method for manufacturing a component built-in device including a laminated body including a plurality of thermoplastic resin layers, a passive element defined by a conductor pattern formed on the thermoplastic resin layers, and a chip electronic component embedded in the laminated body, the method comprising the steps of:
- forming the passive element and a pad electrode connected to the passive element on a predetermined thermoplastic resin sheet among a plurality of thermoplastic resin sheets;
- forming an insulator pattern on a predetermined thermoplastic resin sheet among the plurality of thermoplastic resin sheets at a position that is around the chip electronic component and that overlaps the pad electrode in plan view;
- and
- forming the laminated body by laminating and pressure-bonding the plurality of thermoplastic resin sheets together with the chip electronic component.
Dependencies are inferred from the claim text.