Method for simplification of complex weeding contours
AssigneeGroupeSTAHL
InventorFred Ciaramitaro
Life of this patent
Estimating the term…
Abstract
A method of and system for weeding a design in a substrate have a first layer and a second layer is disclosed. The method and system determines an outline of the design and an inlet portion of the outline. The inlet portion is defined on at least a first and second side by the outline of the design and is open on at least a third side. The method and system cuts through the first layer but not the second layer along at least a portion of the outline that is not included in the inlet portion. The method and system also cuts through both the first and second layers along the inlet portion of the outline. The method and system also cuts through both the first and second layers along a path that closes the third side of the inlet portion.
Claims9
(canceled)
A method of generating a design on a substrate, wherein the substrate has at least a first layer and a second layer, and the design has a design contour that defines at least one inlet portion, the inlet portion being partially, but not completely, surrounded by a portion of the design contour, comprising:
- cutting through the first layer but not the second layer along at least a portion of the design contour outside of the inlet portion;
- cutting through both the first and second layers along the inlet portion of the design contour;
- and
- cutting through both the first and second layers along a path on the substrate, separate from the design contour, that, together with a portion of the design contour, encloses the inlet portion
A method of generating a design having at least one inlet portion on a substrate having at least two layers, comprising:
- generating at least one input data file containing data defining a design contour of the design and data defining at least one spline that is separate from the design and that converts the inlet portion to a cavity;
- providing the input data file to an automated cutting device;
- causing the automated cutting device to cut through the first layer but not the second layer of the substrate along at least a portion of the design contour outside of an inlet portion;
- causing the automated cutting device to cut through both the first and second layers of the substrate along the inlet portion of the design contour;
- causing the automated cutting device to cut through both the first and second layers of the substrate along the spline that is separate from the design and that converts the inlet to a cavity.
Dependencies are inferred from the claim text.