Transdermal microneedle array patch
AssigneesRichhealth Technology Corporation, Richtek Technology Corporation
InventorsJung-Tang Huang, Kuan-Ting Lee, Dahong Qian
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Abstract
Provided is a transdermal microneedle array patch, including: a bottom cover; a top cover; a substrate disposed within the top cover; and a first probe and a second probe disposed between the bottom cover and the top cover and electrically connected the substrate. The first and second probes form an open circuit. While the bottom cover is combined with the top cover to form the transdermal microneedle array patch, the first and second probes form a closed circuit.
Claims20
A transdermal microneedle array patch, comprising:
- a bottom cover;
- a top cover;
- a substrate disposed within the top cover;
- and
- a first probe and a second probe disposed between the top cover and the bottom cover and electrically connected with the substrate, wherein the first and second probes form an open circuit,
- wherein when the bottom cover is combined with the top cover to form the transdermal microneedle array patch, the first and second probes form a closed circuit.
A transdermal microneedle array patch, comprising:
- a bottom cover;
- a top cover;
- a substrate disposed within the top cover and including a dielectric layer and a circuit layer formed on the dielectric layer, wherein an open circuit is formed in the circuit layer is in open circuit;
- and
- a first probe and a second probe disposed between the top cover and the bottom cover,
- wherein when the bottom cover is combined with the top cover to form the transdermal microneedle array patch, the first and second probes are in contact with the circuit layer to enable the circuit layer to form a closed circuit.
Dependencies are inferred from the claim text.