Consumable feedstock for 3d printing and method of use
AssigneeStratasys, Inc.
InventorsVittorio L. Jaker, Brandon Cernohous
Life of this patent
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Abstract
A consumable material configured for use in an additive manufacturing system includes a polymeric matrix having polyetherersulfone (PES) in a range of between about 30 wt % and about 85 wt % of the polymeric matrix and polyphenylene sulfide (PPS) in a range between about 15 wt % and about 70 wt % of the polymeric matrix, wherein the polymeric matrix is in a media form suitable for processing in the additive manufacturing system and having a Tg that is about 190° C. or greater and a coefficient of thermal expansion of less than about 30 μm/(m·° C.). The consumable material is suitable for use in 3D printing of composite mold tools.
Claims22
A consumable material configured for use in an additive manufacturing system, the material comprising:
- a polymeric matrix comprising polyetherersulfone (PES) comprising in a range between about 30 wt % and about 85 wt % of the polymeric matrix and polyphenylene sulfide (PPS) in a range between about 15 wt % and about 70 wt % of the polymeric matrix, wherein the polymeric matrix is in a media form suitable processing in the additive manufacturing system and having a Tg that is about 190° C. or greater and a coefficient of thermal expansion is less than about 23 μm/(m·° C.) to about 29 μm/(m·° C.).
A method for forming a three-dimensional part with an additive manufacturing system, the method comprising:
- providing a feedstock comprising a polymeric material load with fillers wherein the fillers comprise between about 5 vol. % and about 40 vol. % of the feedstock, wherein the feedstock has a Tg that is about 190° C. or greater in a media form suitable for the additive manufacturing system, wherein the feedstock has a coefficient of thermal expansion that is less than about 30 μm/(m·° C.);
- and
- printing a composite mold tool from the feedstock in an additive manufacturing system.
Dependencies are inferred from the claim text.