Method for forming patterned cured film, photosensitive composition, dry film, and method for producing plated shaped article
AssigneeTokyo Ohka Kogyo Co., Ltd.
InventorsMakiko IRIE, Aya MOMOZAWA
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Abstract
A method for forming a patterned cured film using a negative photosensitive composition. The composition includes a photopolymerizable compound and a photopolymerization initiator including an oxime ester compound of a specific structure having a 9,9-disubstituted fluorenyl group which is used for formation of a thick film resist pattern. The composition is mixed with an alkali-soluble resin which is a polymer of a monomer having an unsaturated double bond and includes a unit derived from a monomer having an aromatic group.
Claims13
A method for forming a patterned cured film, the method comprising:
- laminating a photosensitive layer formed from a photosensitive composition on a metal surface of a substrate having the metal surface;
- exposing the photosensitive layer;
- and
- developing the photosensitive layer after exposure, wherein
- the photosensitive layer has a thickness of 80 μm or more,
- the photosensitive composition comprises (A) a photopolymerizable compound, and (B) a photopolymerization initiator, and
- the photopolymerization initiator (B) contains a compound represented by the following formula (1):
- wherein R1 is a hydrogen atom, a nitro group, or a monovalent organic group;
- R2 and R3 each are an optionally substituted chain alkyl group, an optionally substituted cyclic organic group, or a hydrogen atom, R2 and R3 may be bonded to one another to form a ring, R4 is a monovalent organic group, R5 is a hydrogen atom, an optionally substituted alkyl group having 1 to 11 carbon atom, or an optionally substituted aryl group, n is an integer of 0 to 4, and m is 0 or 1.
A photosensitive composition comprising (A) a photopolymerizable compound, (B) a photopolymerization initiator, and (C) an alkali-soluble resin, wherein
- the photopolymerization initiator (B) contains a compound represented by the following formula (1):
- wherein R1 is a hydrogen atom, a nitro group, or a monovalent organic group;
- R2 and R3 each are an optionally substituted chain alkyl group, an optionally substituted cyclic organic group, or a hydrogen atom, R2 and R3 may be bonded to one another to form a ring, R4 is a monovalent organic group, R5 is a hydrogen atom, an optionally substituted alkyl group having 1 to 11 carbon atom, or an optionally substituted aryl group, n is an integer of 0 to 4, and m is 0 or 1, and
- the alkali-soluble resin (C) is a polymer of a monomer having an unsaturated double bond and includes a unit derived from a monomer having an aromatic group.
Dependencies are inferred from the claim text.