Selectively Plated Rolls Of Materials And Related Methods
AssigneeLaird Technologies (Shenzhen) Ltd.
InventorsRichard TSAI, Dusan LEE, Larry Don CREASY, JR.
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Abstract
According to various aspects, exemplary embodiments are disclosed of selectively metal-plated rolls of materials, rolls of materials configured for selective metal plating, and methods for selectively plating rolls of materials. In an exemplary embodiment, a roll of material includes a substrate. An insulating ink is on the substrate. A catalyst coating is on the substrate whereat the insulating ink is not present. The catalyst coating may be configured to provide the substrate with one or more catalytic surfaces suitable for electroless deposition of metal. Accordingly, metal plating may be electrolessly deposited on the catalyst coating without over-plating the insulating ink.
Claims20
A roll of material comprising:
- a substrate;
- an insulating ink on the substrate;
- a catalyst coating on the substrate whereat the insulating ink is not present;
- and
- wherein:
- the substrate includes one or more insulation portions and one or more plating portions;
- the insulating ink is in a pattern on the substrate that defines the one or more insulation portions;
- the one or more plating portions are defined by or coincide with areas in the pattern devoid of the insulating ink;
- and
- the one or more plating portions include the catalyst coating, which is configured to provide the substrate with one or more catalytic surfaces for electroless deposition of metal.
A selectively plated roll of material comprising:
- a substrate;
- an electrically-conductive ink on the substrate;
- and
- a metal plating on the electrically-conductive ink;
- whereby the metal plating is deposited on the electrically-conductive ink without over-plating the substrate whereat the electrically-conductive ink is not present.
A method of selectively plating a roll of material, the method comprising:
- applying an insulating ink on a substrate, applying a catalyst coating on the substrate such that the catalyst coating will be present on the substrate whereat the insulating ink is not present, and depositing a metal plating on the catalyst coating without over-plating the insulating ink;
- or
- applying an electrically-conductive ink on a substrate, and depositing a metal plating on the electrically-conductive ink without over-plating the substrate whereat the electrically-conductive ink is not present.
Dependencies are inferred from the claim text.