Back to results
US 2018/0209749 A1Published application
High efficiency thermal transfer plate
AssigneeSolid State Cooling Systems
InventorsLloyd Wright, Leo A. Chin
Life of this patent
Estimating the term…
Abstract
The present invention provides a high efficiency thermal transfer plate for providing thermal transfer to and from a fluid. More specifically the present invention provides a thermal transfer plate including a skived fin plate for improved thermal transfer between a fluid within the thermal transfer plate and the thermal transfer plate.
Claims20
A thermal transfer plate for use with a thermal exchange unit, said thermal transfer plate comprising:
- a thermal transfer plate body comprising a thermoplastic fluid transport area and additionally comprising an upper thermal transfer plate formed via a skiving and a fluid transport area bounded by multiple thermal transfer plate body sides and an upper sealing surface and a lower sealing surface;
- the upper thermal transfer plate bounding the upper sealing surface to form an upper fluidic seal and comprising an upper single contiguous piece of copper comprising an upper base and multiple upper skived fins with increased roughness on a surface of the respective multiple upper skived fins, wherein the upper skived fins are positioned so that at least a portion of the upper skived fins are within the fluid transport area;
- a lower thermal transfer plate bounding the lower sealing surface to form a lower fluidic seal and comprising a thermal transfer area, wherein the thermal transfer area is positioned so that at least a portion of the thermal transfer area is in fluid communication with the fluid transport area;
- and
- a fluid inlet in fluid communication with the fluid transport area and a fluid outlet also in fluid communication with the fluid transport area.
2 more elements
Dependencies are inferred from the claim text.