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US 2018/0199472 A1Published application
Heat dissipating structure and electronic apparatus
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsYOSHIHIDE NAKANISHI, NORIHIRO YAHATA, HISASHI SERITA, MASAYA KOSHIMUTA
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Abstract
A heat radiation structure includes a heat spreader provided on a heating component mounted on a substrate, a heat sink disposed at a position facing the heat spreader, a heat transfer member disposed between the heat spreader and the heat sink, and transmitting heat from the heat spreader to the heat sink, and a conductive member electrically connecting the heat spreader and the heat sink.
Claims8
A heat radiation structure comprising:
- a heat spreader provided on a heating component mounted on a substrate;
- a heat sink disposed at a position facing the heat spreader;
- a heat transfer member disposed between the heat spreader and the heat sink, and transmitting heat from the heat spreader to the heat sink;
- and
- a conductive member electrically connecting the heat spreader and the heat sink.
2 more elements
An electronic device comprising:
- a substrate;
- a heating component mounted on the substrate, and including a heat spreader;
- a heat sink disposed at a position facing the heat spreader;
- a heat transfer member disposed between the heat spreader and the heat sink, and transmitting heat from the heat spreader to the heat sink;
- and
- a conductive member electrically connecting the heat spreader and the heat sink.
3 more elements
Dependencies are inferred from the claim text.