Method and device for processing photoresist component
AssigneesBoe Technology Group Co., Ltd., Beijing Boe Display Technology Co., Ltd.
InventorsShichao Ma, Pengfei Wang, Chongxi Wei
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Abstract
The present disclosure provides a method for processing a photoresist component, including steps of: placing a photoresist component to be processed on a heating device comprising a plurality of heating components; and controlling, based on a heating parameter, each of the plurality of heating components associated with the heating parameter to heat the photoresist component to be processed. The heating parameter is determined based on a photoresist component parameter of the photoresist component to be processed and a process parameter of forming the photoresist component. The present disclosure further provides a device for processing a photoresist component.
Claims15
A method for processing a photoresist component, comprising steps of:
- placing a photoresist component to be processed on a heating device comprising a plurality of heating components;
- and
- controlling, based on a heating parameter, each of the plurality of heating components associated with the heating parameter to heat the photoresist component to be processed.
A device for processing a photoresist component, comprising:
- a heating device comprising a plurality of heating components and configured to carry a photoresist component to be processed thereon;
- and
- a controller configured to control, based on a heating parameter, each of the plurality of heating components associated with the heating parameter to heat the photoresist component to be processed.
Dependencies are inferred from the claim text.