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US 2018/0178429 A1Published application
Molding apparatus
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsYuan-Hong Sun, Wei-Sheng Lin, Yu-Sheng Chang, Yu-Hsiang Lee, Chien-Chih Chen, An-Fu Lee
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Abstract
A molding apparatus is provided, including a mold, a measurement device configured for sensing a state of the mold, and a calibration device electrically connected to the measurement device and configured for determining a state of a sensing function of the measurement device. Therefore, the problem that the measurement device is too old to accurately sense the state of the mold is solved.
Claims11
A molding apparatus, comprising:
- a mold;
- a measurement device configured for sensing if a state of the mold is normal;
- and
- a calibrating device electrically connected with the measurement device and configured for determining a state of a sensing function of the measurement device.
1 more element
Dependencies are inferred from the claim text.