# US 2018/0172731 A1 · Universal probing assembly with five degrees of freedom > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2018/0172731 A1 - Document ID: US20180172731A1 - Status: Published application - Kind: A1 - Application number: 15/847,754 - Filed: 2017-12-19 - Published: 2018-06-21 - Earliest claimed: 2016-12-20 - Assignees: QualiTau, Inc. - Applicants: QualiTau, Inc. - Inventors: Mirtcha LUPASHKU; Remy ORANS - Web page: https://patentgrep.com/patent/US20180172731A1 ## CPC - G01R 1/06705: {Apparatus for holding or moving single probes (for moving multiple probe heads or ICs under test G01R31/2886)} - G01R 31/2601: {Apparatus or methods therefor (G01R31/2607, G01R31/2642 take precedence)} - G01R 31/2887: {involving moving the probe head or the IC under test; docking stations (moving single probes G01R1/06705; moving individual probes in multiple probes G01R1/07392)} - G01R 1/07307: {with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card} - G01R 31/2865: {Holding devices, e.g. chucks; Handlers or transport devices (having contacts G01R31/2863)} - G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12) ## Abstract A universal multi-pin, adjustable probing assembly or manipulator for use in parametric and reliability testing of devices on a semiconductor wafer. The probing assembly can be mounted and adjusted on a metal platen using a magnetic field. The strength of the magnetic field can be adjusted by a switchable magnetic slab to which a block is connected via an arm. A probe head can be attached to a side face of the block, which includes a tilt control mechanism for tilting the probe head to ensure that probe tips land simultaneously on pads of dies. The probe head also includes four adjusting mechanisms for translation in the X, Y, and Z directions, as well as rotation about the Z axis. ## Claims ### Claim 1 A universal probing assembly for parametric and reliability testing of devices on a semiconductor wafer, the assembly comprising: a switchable magnetic slab; a probe head comprising a plurality of adjusting mechanisms; a block comprising a tilt control mechanism for allowing tilting of the probe head perpendicular to a X-Y plane of the wafer, wherein the probe head is mounted to the block; and an arm having a first end and a second end, wherein the first end is attached to the switchable magnetic slab and the second end is attached to the block. ### Claim 2 (depends on 1) The universal probing assembly of claim 1, further comprising a metal platen, wherein the switchable magnetic slab allows mounting of the arm, block, and probe head to the metal platen by increasing a magnetic field between the switchable magnetic slab and the metal platen. ### Claim 3 (depends on 2) The universal probing assembly of claim 2, wherein the switchable magnetic slab allows release of the arm, block, and probe head from the metal platen by reducing the magnetic field between the switchable magnetic slab and the metal platen. ### Claim 4 (depends on 1) The universal probing assembly of claim 1, wherein the tilt control mechanism comprises a movable part controlled by a screw to tilt the probe head. ### Claim 5 (depends on 4) The universal probing assembly of claim 4, wherein the probe head is mounted on an attachment side face of the block. ### Claim 6 (depends on 5) The universal probing assembly of claim 5, wherein the probe head is attached to a dove-tail receptacle on the attachment side face of the block, wherein the dove-tail receptacle can be tilted by the movable part. ### Claim 7 (depends on 5) The universal probing assembly of claim 5, wherein the block can be attached to the arm using any one of three free side faces of the block, wherein the three free side faces is any side face of the block that is not the attachment side face on which probe head is mounted. ### Claim 8 (depends on 5) The universal probing assembly of claim 5, wherein the probe head comprises four adjusting mechanisms, including for translation along a X axis, a Y-axis, and a Z-axis, and for rotation about a Z-axis, wherein the X-axis, the Y-axis, and the Z-axis are perpendicular to one another. ### Claim 9 (depends on 8) The universal probing assembly of claim 8, wherein the probe head is tiltable about the Y-axis. ### Claim 10 (depends on 1) The universal probing assembly of claim 1, wherein the probe head can be mounted on a rail-based system using a locking mechanism and lever. ### Claim 11 A probing assembly for parametric and reliability testing of devices on a semiconductor wafer, the assembly comprising: a switchable magnetic slab; a probe head comprising a plurality of adjustment mechanisms; a block comprising a tilt control mechanism for allowing tilting of the probe head, wherein the probe head is mounted to the block; and an arm having a first end and a second end, wherein the first end is attached to the switchable magnetic slab and the second end is attached to the block; and a metal platen to which the arm, block, and probe head can be mounted using a magnetic field between the switchable magnetic slab and the metal platen. ### Claim 12 (depends on 11) The universal probing assembly of claim 11, wherein the switchable magnetic slab comprises a switch for adjusting a strength of a magnetic field between the switchable magnetic slab and the metal platen. ### Claim 13 (depends on 12) The universal probing assembly of claim 12, wherein a stronger magnetic field mounts the magnetic slab, arm, and probe head more securely to the metal platen. ### Claim 14 (depends on 11) The probing assembly of claim 11, wherein the plurality of adjusting mechanisms comprises four adjusting mechanisms, including for translation along a X axis, a Y-axis, and a Z-axis, and for rotation about a Z-axis, wherein the X-axis, the Y-axis, and the Z-axis are perpendicular to one another. ### Claim 15 (depends on 14) The probing assembly of claim 14, wherein the four adjusting mechanisms are knobs that can be manually adjusted. ### Claim 16 (depends on 15) The probing assembly of claim 15, wherein the probe head can be tilted about the Y-axis. ### Claim 17 A probing assembly for parametric and reliability testing of devices on a semiconductor wafer, the assembly comprising: a switchable magnetic slab; a probe head comprising four adjusting mechanisms; a block comprising a tilt control mechanism for allowing tilting of the probe head perpendicular to a X-Y plane of the wafer, wherein the probe head is mounted to the block; and an arm that connects the switchable magnetic slab and the block. ### Claim 18 (depends on 17) The probing assembly of claim 17, further comprising a metal platen, wherein the switchable magnetic slab controls a strength of a magnetic field between the switchable magnetic slab and the metal platen. ### Claim 19 (depends on 17) The probing assembly of claim 17, wherein the probe head is attached to a first side face of the block and the block can be attached to the arm on any of a first, second, or third side face of the block. ### Claim 20 (depends on 17) The probing assembly of claim 17, the tilt control mechanism comprises a movable part controlled by a screw to tilt probe head.