Glass substrate assemblies having low dielectric properties

An electronic assembly comprising:

• a glass layer comprising a first surface and a second surface;
• a dielectric layer disposed on at least one of the first surface or the second surface of the glass layer, the dielectric layer having a dielectric constant value of less than about 3.0 in response to electromagnetic radiation having a frequency of 10 GHz;
• a plurality of electrically conductive traces disposed within the dielectric layer, under the dielectric layer, or on a surface of the dielectric layer;
• and
• an integrated circuit component disposed on the surface of the dielectric layer and electrically coupled to one or more electrically conductive traces of the plurality of electrically conductive traces, wherein the integrated circuit component is configured to perform at least one of transmitting or receiving wireless communication signals.

A method of fabricating a glass substrate assembly, the method comprising:

• heating a glass substrate to a first temperature that is greater than a strain point of the glass substrate and less than a softening point of the glass substrate;
• maintaining the glass substrate within about 10% of the first temperature for a first period of time;
• cooling the glass substrate to a second temperature over a second period of time such that, following the cooling the glass substrate, the glass substrate has a dielectric constant value of less than about 5.0 in response to electromagnetic radiation having a frequency of 10 GHz;
• and
• applying a dielectric layer to at least one surface of the glass substrate, the dielectric layer having a dielectric constant value of less than about 2.5 in response to electromagnetic radiation having a frequency of 10 GHz.