High temperature resistant pressure sensitive adhesive with low thermal impedance
AssigneePolyonics Corporation
InventorsDelilah F. Adams, Robert H. Guyette, JR., Donald P. Nieratko
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Abstract
A high temperature resistant thermally conductive pressure sensitive adhesive composition comprising a first silicon resin, a second silicon resin, a first thermally conductive filler, a second thermally conductive filler, a catalytically effective amount of a curing agent, an optional defoaming agent, and an optional drying agent, wherein said thermally conductive filler has a volume weighted mean particle size in the range of 8 to 20 μm.
Claims26
A high temperature resistant thermally conductive pressure sensitive adhesive composition, comprising:
- two or more silicon resins;
- two or more thermally conductive fillers;
- and
- a catalytically effective amount of a curing agent;
- wherein said two or more thermally conductive fillers have a volume weighted mean particle size in the range of 8 to 20 μm.
A high temperature resistant thermally conductive pressure sensitive adhesive tape construction, comprising:
- a substrate having a first major surface and a second major surface opposite the first major surface;
- and
- a first pressure sensitive adhesive layer disposed on the first major surface, the first pressure sensitive adhesive layer being formed of a pressure sensitive composition, the pressure sensitive adhesive composition comprising two or more silicon resins, two or more thermally conductive fillers, and a catalytically effective amount of a curing agent, wherein said two or more thermally conductive fillers have a volume weighted mean particle size in the range of 8 to 20 μm.
A method for making a tape construction comprising a pressure sensitive adhesive laminated to a substrate, comprising:
- forming a pressure sensitive adhesive reaction mixture by admixing two or more silicon resins, two or more thermally conductive fillers, and a catalytically effective amount of a curing agent;
- adding a solvent to the reaction mixture to provide a reduced viscosity mixture;
- milling the reduced viscosity mixture to reduce the particle size of the two or more thermally conductive fillers, wherein the two or more thermally conductive fillers have a volume weighted mean particle size in the range of 8 to 20 μm to provide a reduced particle size mixture;
- applying a thin film of the reduced particle size mixture to the substrate to provide a coated substrate;
- drying the coated substrate to remove the at least a portion of the solvent from the reduced viscosity mixture.
The method of claim 22, wherein the substrate is treated with a release agent.
Dependencies are inferred from the claim text.